Wafer Internal Stress Tester SV200

Product Overview

It has the detection functions of stress distribution measurement and defect screening in compound wafers

Application Direction

It is suitable for internal stress detection of third-generation compound wafers, glass wafers, and precision optical components (flat crystals, prisms, wave plates, lenses, etc.).

Technical characteristics

Advantage

• Based on the birefringence stress measurement model, the instantaneous measurement of stress is realized, and the pseudo-color map of the two-dimensional distribution of stress is displayed
  
• Adopt double telecentric detection optical path, and the phase delay measurement accuracy is high
  
• According to different measurement field requirements, a variety of lenses are available
  
• Customized sample trays to adapt to wafer batch testing of different specifications

Fields of application

• It is suitable for compound wafer production, optical precision processing and other industries