ALD atomic layer deposition system (ultra-high vacuum series)

atomic layer deposition system

ALD (Atomic Layer Deposition) system provides atomic-level precision film formation and growth on complex 3D micro-nano structures. It enables high uniformity, high density, conformal films suitable for multiple fields: nanomaterials, solar cells, catalysis, lithium batteries, optical coatings, biomedical, and OLED.

Applications

• Nanomaterials High uniformity nanoscale films for MEMS, dielectric layers, hydrophobic/biocompatible coatings.

• Solar Cells AlO passivation layer improves c-Si solar cell efficiency.

• Catalysis Core-shell, oxide/heterogeneous catalysts, single-atom catalysts, bimetallic nanocatalysts.

• Lithium Batteries Separator coatings, cathode/anode protective layers, dendrite suppression, artificial SEI.

• Optical Coatings High-density films on complex geometries, better than PVD for advanced optical devices.

• Biomedical Dense protective coatings on implants, drug particle encapsulation, regenerative medicine substrates.

• OLED/LED Nano encapsulation films for flexible OLED packaging, improved LED passivation.

Specifications

• Depositable Films: High-K dielectrics (AlO, ZrO, TaO, etc.), metallic interconnects (Cu, Ru, TaN), catalytic materials (Pt, Ir, Co, TiO), biomedical coatings (TiN, ZrN, TiAlN), piezoelectrics (ZnO, AlN), transparent conductors (ITO, ZnO:Al), photonic crystals.

• Cabinet: Aluminum frame, carbon steel painted shell.

• Control: PLC + industrial computer, interlock system.

• Operation Software: Security functions, parameter config, IO interlock, user rights management.